Three days of open house for Gallus, which on the occasion of the celebration of the 100th anniversary of the Group invited its customers from 21 to 23 June to its headquarters in St. Gallen in Switzerland for the...
We are publishing a comprehensive preview of the technological innovations that will be available to see and experience at Labelexpo 2023, taking place in Brussels from September 11th to 14th: 4 days of event, 9 pavilions, over 600 exhibitors,...
WEPACK (World Expo of Packaging Industry) 2023 is scheduled to be held on July 12-14: the event will be as a forward-looking, exploratory and influential super gala that covers the entire industry chain of packaging worldwide together with these...
With an event at its headquarters in Altstätten in Switzerland, on April 19 and 20 Zünd presented the new Q-Line with Board Handling System BHS180 and Undercam, redefining the standards of “pallet-to-pallet” digital converting. A top-of-the-range technology that does...
Durst Group has announced its premier partnership with the EcoPrint Summit, taking place on 6-7 June 2023 in Geneva, Switzerland. Durst’s commitment to sustainability in print, coupled with the support of industry leaders, reflects the growing importance of ecological...
Tarsus Group, organizer of the Labelexpo Global Series, has announced that Labelexpo Europe will move from its current location at Brussels Expo to Barcelona Fira for the 2025 edition. The move does not affect the upcoming Labelexpo Europe 2023,...
Durst Group, a leading manufacturer of advanced digital printing and production technologies, hosted the exclusive Durst Beyond event to showcase its latest technology innovations and inspire the printing industry. The event was held at Durst's global headquarters in Brixen,...
Gallus Group will be attending this year’s Interpack in Düsseldorf, Germany, 4-10 May (Hall 8A, Stand E53). The company will use the show to present, for the first time at a tradeshow, the Gallus UVF01 ink set – new...
On 23 February, the third day of "Future of Flexo" conference conceived and promoted by Z Due, Reproflex3, I&C Gama and Tamburini, gathered around 200 operators of corrugated cardboard sector who attended technical presentations, case histories and round tables,...
SERVIFORMA – DIE-CUTTING TECHNIQUES FROM A TO Z is a highly successful training programme designed and implemented by Serviform, a leading company in technologies and services for die-cutters, paper processing industries and box manufacturing plants. Now in its 7th...
